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The term electromigration refers to mass transport in metals under high-stress conditions especially under high current densities and high temperatures. This phenomenon has been studied in different metallizations during the last several years [1 61] and presents a key problem in VLSI circuits since it causes open-circuit and short-circuit failures in the VLSI interconnections. Currently, there is a trend to fabricate VLSI circuits on small chip areas to save space and reduce propagation delays. According to scaling theory for both bipolar and FET circuits, if the chip area is decreased by a factor k, the current density increases by at least the same factor in both cases, and this becomes one of the primary reasons for circuit failure. This chapter is organized as follows: Several factors related to electromigration in the VLSI interconnection metallizations are reviewed in Section 5.1. In this section, the basic problems that cause electromigration are outlined, the mechanisms and dependence of electromigration on several factors are discussed, testing and monitoring techniques and guidelines are presented, and the methods of reducing electromigration in VLSI interconnections are brie y discussed. Various models of IC reliability, including the series model of failure mechanism in VLSI interconnections, are presented in Section 5.2. A model of electromigration due to repetitive pulsed currents is developed in Section 5.3. Electromigration in the copper interconnections under direct current (DC) and alternating current (AC) conditions is discussed in Section 5.4.

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Figure 7.38 Buffer example (decoder; channel bitrate 100 kbps)

x, y, z, (Z = z) > 0 : (X = x, Y = y | Z = z) = min{ (X = x | Z = z), (Y = y | Z = z)} x, y, z, R(Z = z) > 0 : (Y = y, X = x | Z = z) = min{ (Y = y | Z = z), (X = x | Z = z)} Y X | Z.

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This chapter begins with a summary of those portions of Section 504 of The Rehabilitation Act of 1973 most pertinent to school psychological practice. Special attention is given to the similarities and differences between Section 504 and Individuals with Disabilities Education Act (IDEA) regarding school responsibilities to pupils with special needs.1 The second portion of the chapter provides a brief overview of the Americans with Disabilities Act (1990).

scratches, lint, bubbles, and dirty lens surfaces Adjustments of DIC optical components are critical to imaging performance, so it is important to recognize misalignments and faults and correct them if necessary The appearance of the image at different steps of alignment is shown in Figure 10-7, and the operation is performed as follows: 1 Cross the polarizer and analyzer The polarizer (near the light source) is oriented in an east-west direction as you face the microscope A mark on the mounting ring of the polarizer indicates its transmission axis Before adjusting the analyzer, remove all optical components, including the condenser, the objective lens, and DIC prisms When the analyzer is crossed at 90 with respect to the polarizer, the field looks maximally dark (extinction) when observed through the eyepieces.

Parameter-passing of atomic types has a call by value (C BV) semantics for both local and remote methods. This means that the called method works with a copy of the value. Objects are passed using call by reference (C BR) to local method calls, which means that rather than passing the object to the invoked method, only the object reference is passed. H ence, both the invoking and the invoked method work with the same object. This is different for some remote method invocations. Passing a non-remote object to a remote method will copythe passed object. As a consequence non-remote object parameters always have to be serializable; their classes have to implement the j a v a . i o . S e r i a l i z a b l e interface.

Pure solvents Solvents 1) Sulfuric acid 2-Aminoethanol Formic acid N-Methylformamide Hydrogen fluoride Water Acetic acid 1,2-Diaminoethane Ethylene glycol Formamide Methanol Ethanol 1-Propanol Hexamethylphosphoric triamide * 1-Pentanol 2-Propanol 1-Butanol Ethyl acetate Nitromethane * 1-Methyl-2-pyrrolidone * Sulfolane * Propylene carbonate* N,N-Dimethylacetamide N,N-Dimethylformamide * Ammonia Acetone * Dimethyl sulfoxide * Acetonitrile * pKSH 3.33 5.7 6.2 10.74 12.5(0 8C) 14.00 14.45 15.2 15.84 16.8(20 8C) 16.71 18.9 19.43 20.56

Should this patient have surgery for the adnexal mass, or may she be followed conservatively Should she be referred to a gynecologic oncologist

GaAs MESFET Si MOSFET HEMT (77K)

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